Tundra Semiconductor Corporation

Address: 603 March Rd.
Kanata, ON K2K 2M5
CA

Mailling Address: 603 March Rd.
Kanata, ON K2K 2M5
CA

Phone: (613) 592-0714

Toll Free: 1(800) 267-7231

Fax: (613) 592-1320

Email: Click Here

Map it: Click Here

Website: http://www.tundra.com

Tundra Semiconductor Corporation

Tundra Semiconductor Corporation designs, develops, and markets
standards-based System Interconnect for use by the world's
leading communications and storage system companies. Tundra
supports RapidIO, VME, PCI standards.

Tundra System Interconnect is a vital communications technology
that enables customers to connect critical system components
while compressing development cycles and maximizing
performance. Applications include wireless infrastructure,
storage networking, network access, military applications, and
industrial automation.

Tundra headquarters are located in Ottawa, Ontario, Canada. The
Company also has a design center in South Portland, Maine, a
European sales office in Maidenhead, U.K., and an American
sales office in Dallas, Texas. Tundra sells its products
worldwide through a network of direct sales personnel,
independent distributors and manufacturers' representatives.
Tundra employs about 200 employees worldwide.

Telephone: 613-592-0714
Website: www.tundra.com
Email: inquire@tundra.com

Company Details

Year Established: 1995

Total Sales ($CDN): $10,000,000 - $25,000,000

Number of Employees: 200

Company Information

Veronica Farmer
Title: Manager
Area of Responsibility: Domestic Sales & Marketing
Telephone: (613) 592-0714
Fax: (613) 592-1320

Terry Closs
Title: Manager
Area of Responsibility: Export Sales & Marketing
Telephone: (613) 592-0714
Email: Click Here

Joe Connelly
Title: Vice President
Area of Responsibility: Domestic Sales & Marketing
Telephone: (613) 592-0714
Fax: (613) 592-1320
Email: Click Here

James Roche
Title: Chief Executive Officer
Area of Responsibility: Management Executive
Telephone: (613) 592-0714
Fax: (613) 592-1320
Email: Click Here

Richard O'connor
Title: Vice President
Area of Responsibility: Domestic Sales & Marketing
Telephone: (613) 592-0714
Fax: (613) 592-1320
Email: Click Here

Products

Integrated Circuits

Bus Bridge (qspan Ii)
QSpan II is an industry-proven, Motorola processor-to-PCI System Interconnect device. It enables board designers to bring PCI-based embedded products to market faster, for less cost, and with high performance. Developed as part of an ongoing strategic relationship with Motorola, QSpan II is designed to gluelessly bridge the PowerQUICC (MPC860 / MPC850 / MPC821), the QUICC (MC68360) and the M68040 processors to the PCI bus. With additional glue logic, QSpan II can also be connected to lower-end communications controllers and processors, such as the MC68302 and MC68030. QSpan II is a pin and function super-set of the QSpan PBGA package. This allows current QSpan customers to immediately prototype designs with the QSpan II. Typical Applications: Network interface cards, Routers, Servers, Process control equipment, Data acquisition systems, any 68K-based or PowerPC-based system migrating to the PCI bus.

Pci Bus Bridge (universe Ii)
The Universe II builds on Tundra's existing, single chip VME64 interface, the SCV64. Its excellent performance is the product of the decoupling architecture unique to Tundra. The Universe II uses built-in FIFOs to decouple the transfer of data between the VMEbus and PCI Bus, to compensate for mismatches in relative bus performance. In addition to the advantage of decoupling, the Universe II offers block transfer capability including BLT and MBLT, an integral DMA controllers, and a high speed VMEbus port. As with the SCV64, the Universe implements a full suite of VMEbus address and data transfer modes include D64. In addition, it rovides full VMEbus system controller functionality with multi-level arbitration modes. All VMEbus features are fully programmable from the PCI and VMEbus sides, making the Universe II a flexible interface solution. With its other VMEbus functions, the Universe II provides full VMEbus interrupter and interrupt handler capability, automatic system controller logic, and a multilevel VMEbus requester. The Universe II offers tremendous board area savings through the use of BGA packaging technology. With a contact array pitch of 0.050 inches, the overall package size of the Universe is less than one square inch. Wide Array of Applications: Typical applications include: single board computers, telecommunications equipment, test equipment, command and control systems, factory automation equipment.

Scv64
The SCV64, the pioneering VME64 solution, provides the high-speed VME64 data path seen in many of today's high performance VME applications. With data transfer rates up to 60 MBytes/second, the SCV64 ensures that even the most demanding applications won't find a bottleneck when they need to access resources on the VMEbus. And its unique decoupled architecture guarantees that while making those transfers, the processor and local bus won't be wasting any precious bandwidth waiting for bus or resources access to be granted. The SCV64 uses internal FIFOs to decouple the transfer of data between the VMEbus and local bus to compensate for mismatches in relative bus performance, permitting each bus to operate at its optimal rate, unimpeded by the other. Block transfer capability (both BLT and MBLT), an integral DMA controller, an asynchronous VMEbus interface and 40MHz local bus operation round out the features that make the SCV64 the number one choice of board designers requiring high performance interfaces. Because it is a fully compliant VME64 interface, the SCV64 gives designers a ready-made VMEbus interface simplifying the implementation of VMEbus compliant boards. The SCV64's flexible local bus interface also allows connections to a variety of processor families, including the following: Intel's x86 and ix60, Motorola's 680xO, and Texas Instruments TMS320CxO. For slave-only designs, the SCV64 offers auto-boot logic for automatic base addressing - providing the ability to tap into the capabilities of the SCV64 without the penalty of on-board intelligence. Tundra can provide Verilog model and Logic Modeling support to improve time-to-market for new SCV64 designs. Wide Array of Applications: Typical applications include: control systems (military and commercial), application accelerators, video graphic, communication systems and DSP systems such as medical imaging.

Host Bridge (tsi107)
Previously known as the MPC107 from Motorola Semiconductor The Tundra Semiconductor Corporation (Tundra) Tsi107 TM PowerPC Host Bridge provides system interconnect between PowerPC processors, PCI peripherals and local memory. The Tsi107 processor interface supports Motorola and IBM PowerPC processors at frequencies up to 133 MHz. It also supports a wide variety of system configurations by providing support for a second processor and a local slave device. The PCI bus allows system designers to design systems quickly due to the vast number of PCI peripheral devices that are available. The Tsi107 PCI interface supports frequencies up to 66 MHz and can operate as both a master and a target on the bus. The memory interface controls processor and PCI interactions to main memory. It supports a variety of programmable DRAM (FPM, EDO), SDRAM, and ROM/Flash ROM configurations. The memory interface support timing at speeds of up to 133 MHz. The Tsi107 provides many of the other necessities for embedded applications, including a high-performance memory controller and dual-processor support; two-channel flexible DMA controller; an interrupt controller; an inter-integrated circuit (I2C) controller; and low-skew clock drivers. The Tsi107 can be used in either a system host configuration or as a peripheral device. For system applications where cost, space, and power consumption are critical parameters, the Tsi107 provides a complete solution without sacrificing performance.

Rapidio Bus Switch (tsi500)
The Tundra Tsi500 is a high performance RapidIO multi-port bus switch based on the RapidIO standard. RapidIO is a point-to- point, packet-switched interconnect protocol that meets the needs of current and future embedded applications. The Tsi500 has four RapidIO interfaces, which operate with an 8-bit data width. Each RapidIO interface on the Tsi500 has performance monitoring capabilities, which enables performance and statistics gathering of data traffic on each interface. The performance monitoring capability optimizes system efficiency by highlighting areas of improvement in the system, hardware design, and traffic flow. The core of the Tsi500 is an advanced Switching Fabric, as illustrated below. This architecture reduces read and write transaction latencies. The switching fabric uses concurrent read prefetching, and supports reads from multiple I/O devices in parallel, non-blocking streams. This surpasses the performance of conventional FIFO-based designs that are constrained to single reads between two buses.

Encryption

Rapidio Bus Bridge (tsi400)
The Tsi400 is a high-performance bus bridge that connects RapidIO devices to PCI devices. RapidIO is a point-to-point, packet-switched interconnect protocol that meets the needs of current and future embedded applications. The Tsi400 PCI Interface is compatible with the PCI 2.2 protocol, and can operate from 25 MHz to 66 MHz. This allows investments made in PCI-based applications to be migrated to the faster, more reliable, RapidIO technology. The RapidIO interface on the Tsi400 operates at 250 or 500 MHz. The data transfer rates offered by the device range from 4 to 16 Gbit/s. An advanced Queuing Structure forms the core of the Tsi400. This architecture enables a high degree of concurrency between the PCI and RapidIO interfaces. When used in combination with a RapidIO switching fabric device, such as the Tsi500, the Tsi400 provides a seamless PCI connectivity across a RapidIO interconnect architecture. By combining the scalability and reliability of a RapidIO switched architecture with the benefits of the rich PCI infrastructure, compelling system level architectures are the result.

Telecom Equipment

Host Bridge (tsi106)
Previously known as the MPC106 from Motorola Semiconductor The Tundra Tsi106 provides proven system interconnect between PowerPC host processors, the PCI bus and local memory. The Tsi106 integrates secondary cache control and a high- performance memory controller that supports DRAM, SDRAM, ROM, and Flash ROM. The Tsi106 processor interface supports Motorola and IBM PowerPC processors at frequencies up to 83 MHz. It also supports a wide variety of system configurations by providing support for up to four processors and a local slave device. The PCI bus allows system designers to design systems quickly due to the availability of a vast number of PCI peripheral devices. The Tsi106 PCI interface supports frequencies up to 33 MHz and can operate as both a master and a target on the bus. The Tsi106 is implemented using advanced, 3.3volt CMOS technology. The device is packaged in a 21 x 25 mm flip ceramic ball grid array (CBGA) with 303 balls. The Tsi106 is available in both commercial and industrial temperature ranges.

Pci Bus Bridge (powerspan Ii)
The Tundra PowerSpanTM II is a Multi-port PCI Bus Switch that bridges PCI to the PowerQUICC II (MPC8260), MPC7xx, PowerPCTM 7xx, and the Wintegra WinPathTM processors. PowerSpan II is available in either a single PCI or dual PCI variant. PowerSpan II defines a new level of PCI bus switch flexibility. PowerSpan II has a Switched PCI architecture, which maximizes transfer concurrency and improves the efficiency and burst performance on the PCI and processor busses. It is now available in 23mm & 27mm BGA packages. Along with a revolutionary Switched PCI architecture, PowerSpan II features integrated PCI-to-PCI bridging, concurrent prefetch read capability, multi-port Direct Memory Access (DMA) operation and CompactPCI Hot Swap support. PowerSpan II is available in Single or Dual PCI variants. The Single PCI PowerSpan II is a two-port device that has a PCI interface and a PowerPC bus interface. The Dual PCI PowerSpan II is a three-port device that has two PCI interfaces and a PowerPC bus interface. The PowerSpan II in conjunction with the PowerPro - PowerPC memory controller, provide a 100 MHz PowerPC interconnect solution. This flexible offering allows designers to leverage the PowerSpan and PowerPro devices across many different system architectures with a common investment in software.

Pci-x Bus Bridge
The Tundra Tsi310TM PCI-X bridge is the industry standard, 64- bit, 133 MHz PCI-X to PCI-X Bridge chip. Interfaces can be independently configured to operate in PCI or PCI-X mode allowing for efficient, hierarchical expansion of I/O bus structures. The Tundra Tsi310 feature set supports applications with embedded subsystems on the secondary bus of the bridge. The evolutionary PCI-X I/O technology increases system performance with greater throughput and efficiency. It provides up to eight times more speed than PCI bus technology, and delivers the high performance required for enterprise, telecommunications, and data communications systems. The Tsi310 transparently connects two electrically separate PCI- X bus domains, allowing concurrent operations on both buses. This results in good utilization of the buses in various system configurations and enables hierarchical expansion of I/O bus structures. As described by the PCI-X architecture, the Tsi310 is capable of handling 64-bit data at a maximum bus frequency of 133 MHz (depending upon the bus topology and load) and is backward compatible with all 3.3V I/O conventional PCI interfaces. The Tsi310 also provides extensive buffering and prefetching mechanisms for efficient transfer of data through the device, facilitating multi-threaded operation and high system throughput. Technology Highlights The Tsi310 is implemented using advanced CMOS technology, which is a 0.25 micron (m) lithography process with a 0.18 m L effective. The device requires two power sources, one at 2.5 V for internal logic and the other at 3.3 V to power the device I/O circuits. The device is packaged in a 31mm thermally and electrically enhanced plastic ball grid array (H-PBGA) with 304 balls.

Rapidio

Powerpc

Vme

Pci

Pci-x

Services